Ticket #1302 (assigned defect)

Opened 8 years ago

Last modified 8 years ago

test bonding on master.ipp

Reported by: jhoblitt Owned by: cindy
Priority: normal Milestone:
Component: hardware Version:
Severity: normal Keywords:
Cc:

Description

Configure ethernet bonding between master.ipp and the IPP switch in the machine shop. First roll this conf out to all ipp dev machines then the production cluster at MHPCC.

Change History

Changed 8 years ago by eugene

  • owner changed from jhoblitt to cindy
  • status changed from new to assigned

we are currently using only 50% of our possible ethernet bandwidth. the described work would allow us to use both ethernet ports on each box.

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